Microscopy and Microsection AnalysisWe make the hidden visible
The causes of failure are often hidden in the smallest components of a device. Our microscopy laboratory department pinpoints these faults.
Our core expertise is the assessment of solder joints by means of cross-sections. We are familiar with current assessment standards, e. g., IPC-A-610 and ECSS-Q-ST-70-08. For the latter, our experienced team members are ESA-certified (Cat. 2 Inspector). If we need to take an even closer look, the scanning electron microscope comes into play. And with its associated EDX probe, we can even determine whether the solder has the correct elemental composition.